Textbook in PDF format

This groundbreaking resource presents cutting-edge post-processing techniques for the monolithic integration of MEMS. You learn how to select MEMS structural layers that can be processed on top of standard pre-fabricated electronics and will optimize the performance and reliability of the MEMS device. Supported with over 240 illustrations, the book details a modular integration process that won't modify the electronics fabrication process or impose any limitation for optimizing the physical properties of the MEMS structural layers. You discover how to enhance crystallization of semiconductor materials locally without affecting underlying metal layers, and learn how to eliminate stress gradient, reduce mean stress, and optimize electrical conductivity of the MEMS structural layer at a CMOS backend compatible temperature. The book provides expert guidance in selecting deposition techniques for MEMS structural layers that enhance growth rate and at the same time yield attractive physical properties for a wide range of applications. Moreover, this comprehensive volume explains how to determine the maximum processing temperature of MEMS on top of standard pre-fabricated electronics to help you avoid damage to the driving electronics